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Lead Free Wave Soldering

The article is regarding the lead free wave soldering process. This article is regarding the various tests performed on different metal alloys so as to make them most efficient in terms of delivering lead free product.

Author: Joseph Callum

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In the modern day with the growth in the technology there are various factors which are being monitored while going for the implementation of any new technology. Same is happening in the field of wave soldering, as we all know that the process of wave soldering is becoming largely popular among the peoples involved in the business of wave soldering and also in the business of manufacturing of Printed Circuit Board.

Now as the use of wave soldering is becoming increasingly prevalent, peoples are pretty much concerned about the inclusion of the lead in the process. They are trying hard to minimize the affect of lead in their process so as to make the product manufactured by them even better in terms of quality and durability. The process like thermal profiling and reflow profiling are being monitored in an improved form.

Various questions have been rising regarding the dissolution of the lead in the lead free alloys during the process of wave soldering. Peoples are more concerned regarding the use of the metal alloys which may use greater solder pot maintenance just because of the higher copper dissolution rates for the alloys. Various engineering tests are being performed on different metals so as to get the results of different metal alloys for the rate of copper dissolution if their pots are being used in the wave soldering. These tests determine that if their any significant change in the absorption of the copper by different metal alloys at different wave soldering temperatures.

After the various test performed on the different metal alloys which can be used as the wave soldering pots the engineers found that in order to minimize the dissolution of the copper into lead free wave solder pots, the printed circuit board which are to be manufactured after the wave soldering process should be designed to have a coating of the solder barrier metal on them. Generally engineers prefer to use the metal Nickel as the solder barrier metal for this process, and the results for Nickel has being quite satisfying in terms of the quality and the consistency in the quality. Though in some cases some manufactures prefers to use Gold in place of Nickel, but this has not been that much affective as the Gold gets deposited in the pots of the wave soldering process. Regardless of the metal chosen for the solder barrier metal this process has a major drawback as the cost of the changeover required for the metal and the waste cost will increases dramatically after the implementation of the solder barrier metal.

So the lead free wave solder Profiling is quite easy and efficient to have but there are some of the drawbacks which may create a doubt in the mind for the manufacturer regarding the implementation of the wave solder barrier metal for having lead free wave soldering.

About Author

The author has been actively in the business of the wave soldering and hence keeps collecting the information regarding the improvements in the wave soldering process, this article is also about the information he got from www.swpc.co.il.

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